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IEEE DIES ICHVE Conferences are a series of international conferences sponsored by the Dielectrics and Electrical Insulation Society (DEIS) of the Institute of Electrical and Electronics Engineers (IEEE). These conferences provide a platform for researchers, faculty, industrial representatives, and students to share their state-of-the-art research on topics such as electromagnetic fields, grounding systems, high voltage insulation systems, aging, space charge, and industrial applications, among others.

The first conference in this series was held in Chongqing, China, in 2008, and since then, it has been held every two years, alternating between China and other parts of the world. 

Year Chairman University, Location, Country
2008 Sun, Caixin Chongqing University, China
2010 Grzybowski, S. Mississippi State Univ., Starkville, USA
2012 Liao, Ruijin Chongqing Univ., China
2014 Rakowska, A. Poznan Univ. of Technology, Poland
2016 Li, Jian Chongqing Univ., China
2018 Gonos, I. F. National Technical Univ., Athens, Greece
2020 He, Jinliang Tsinghua Univ., Beijing, China
2022 Wang, Feipeng Chongqing Univ., China

The next conference is scheduled to be held in Berlin, Germany, in 2024.

The DEIS also sponsors other international conferences such as the Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), the Electrical Insulation Conference (EIC), and the International Conference on Dielectrics (ICD). These conferences cover a wide range of topics related to dielectrics and electrical insulation and provide a forum for researchers to share their research findings and practical experiences.

The conference focusses on the challenges that come with generating, transmitting and utilizing electrical energy in a safe and reliable manner without taking an undue toll on the environment and future generations. Main Topics of the event include among others high voltage insulation systems, testing and Monitoring, electromagnetic fields, transients and EMC, grounding systems, energy and industrial applications, aging and diagnostics, and space charge.

In conclusion, IEEE DIES ICHVE Conferences are an excellent opportunity for researchers, faculty, industrial representatives, and students to share their research findings and practical experiences in the field of dielectrics and electrical insulation. The conferences have been held successfully for over a decade and have become a reference point for the exchange of knowledge and experiences in high voltage and power engineering.