New Abstract Submission Deadline: February 15, 2024
It is with great enthusiasm that we extend a warm invitation for your active participation in the 2024 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2024). This premier event is set to take place at Technische Universität Berlin, Germany from August 18 to 23, 2024. We are looking forward to your paper submission.
The Technische Universität Berlin (TU Berlin) has successfully applied to host the IEEE International Conference for High Voltage Engineering and Application 2024, sponsored bei the Dielectrics and Electric Insulation Society (DEIS). This will be the eighth installment of this conference series. The organization process is in full swing and new updates will be posted here.